This may look like a regular RAM chip, but it packs a mighty punch. This is the latest chunk of DDR4 RAM to roll off Samsung’s production line, and it squeezes a giddying 128GB into its little frame.
The chip, designed for big enterprise servers, uses Samsung’s “through-silicon-via” (TSV) manufacturing technique, which allows it connect RAM chips vertically using electrodes passing through the holes rather than more conventional wiring. In turn, that allows it to build up RAM in larger 3D stacks, to squeeze more memory into the same footprint.
In this case, Samsung squeezes in 144 DDR4 chips, arranged into 36 4GB DRAM packages, to provide 128 glorious gigabytes of memory. Samsung claims that the new chip “boasts the largest capacity and the highest energy efficiency of any DRAM modules today”. It’s zippy, too, running at 2,400 megabits per second.
There’s no word yet on pricing. But it will likely be more expensive than you can justify for humble home PCs.