We’ve all read enough rumours to know that Apple seems hellbent on making its iPhone 7 so thin that it won’t be able to hold a 3.5mm headphone jack. Instead, the company’s said to be working on a set of headphones you can plug into the Lightning port… so you won’t be able to charge it and listen to music at the same time. Fantastic.
However, with the iPhone 6S already just 7.1mm thick, how’s the company going to shave even more off the frame? A new report says that Apple’s going to use a new technology, dubbed ‘fan out packaging’, to shrink the handset’s antenna switching module and RF chip.
This would apparently help the company increase the density of I/O terminals and pack the iPhone 7’s internal components closer together. Ta-dah, the obsession with slimness goes on.
Read More: iPhone 7 Rumours and Leaks
The iPhone 7 is expected to be unveiled at a smarmy Apple event in September. Follow the link above for everything we think we probably might know about the device so far. [AppleInsider]